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TI900 Silicone Based Thermally Conductive Insulators Slide 3

TI900 material has a thermal conductivity of 1.8 W/m.k and is designed for applications where the lowest possible thermal impedance is needed. The principle applications of the product are to enhance heat-flow from a device to the heatsink and to provide electrical isolation. TI900 can provide both of these functionalities and offers a good design solution.

PTM Published on: 2012-02-21