Lead Free No-Clean Solder Paste SAC305 Jar, 8.8 oz (250g)
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4900P-250G

DigiKey Part Number
4900P-250G-ND
Manufacturer
Manufacturer Product Number
4900P-250G
Description
LEAD FREE NO CLEAN SOLDER PASTE
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste SAC305 Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
MG Chemicals
Series
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
SAC305
Diameter
-
Melting Point
423 ~ 430°F (217 ~ 221°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
-
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
48 Months (Refrigerated), 12 Months (Room Temp)
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
39°F ~ 50°F (4°C ~ 10°C)
Base Product Number
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In-Stock: 7
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All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R2 680,91000R2 680,91
5R2 309,54200R11 547,71
10R2 165,41400R21 654,14
25R1 988,03400R49 700,85
50R1 863,07620R93 153,81
Manufacturers Standard Package