
70-3213-0810 | |
|---|---|
DigiKey Part Number | 70-3213-0810-ND |
Manufacturer | |
Manufacturer Product Number | 70-3213-0810 |
Description | SOLDER PASTE NXG1 NO CLEAN 500GM |
Manufacturer Standard Lead Time | 2 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) |
Datasheet | Datasheet |
Category | Mesh Type 3 |
Manufacturer Kester Solder | Process Lead Free |
Series | Form Jar, 17.64 oz (500g) |
Packaging Bulk | Shelf Life 8 Months |
Part Status Active | Shelf Life Start Date of Manufacture |
Type Solder Paste | Storage/Refrigeration Temperature 32°F ~ 50°F (0°C ~ 10°C) |
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Digi-Key Storage Refrigerated |
Melting Point 423 ~ 424°F (217 ~ 218°C) | Shipping Info Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Flux Type No-Clean | Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | R4 196,11000 | R4 196,11 |
| 5 | R3 613,78400 | R18 068,92 |
| 10 | R3 387,64300 | R33 876,43 |
| 30 | R3 056,39833 | R91 691,95 |
| 50 | R2 912,94840 | R145 647,42 |









