Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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70-3213-0810

DigiKey Part Number
70-3213-0810-ND
Manufacturer
Manufacturer Product Number
70-3213-0810
Description
SOLDER PASTE NXG1 NO CLEAN 500GM
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Kester Solder
Series
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 424°F (217 ~ 218°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
8 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Digi-Key Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
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In-Stock: 20
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All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R4 031,45000R4 031,45
5R3 472,07600R17 360,38
10R3 254,85100R32 548,51
30R2 936,69500R88 100,85
50R2 798,90780R139 945,39
Manufacturers Standard Package