Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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70-4021-1410

DigiKey Part Number
70-4021-1410-ND
Manufacturer
Manufacturer Product Number
70-4021-1410
Description
SOLDER PASTE NO CLEAN 500GM
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
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Category
Mesh Type
4
Manufacturer
Kester Solder
Process
Lead Free
Series
Form
Jar, 17.64 oz (500g)
Packaging
Bulk
Shelf Life
12 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Digi-Key Storage
Refrigerated
Melting Point
423 ~ 424°F (217 ~ 218°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 59
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All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R4 338,94000R4 338,94
5R3 736,78600R18 683,93
10R3 502,87400R35 028,74
30R3 160,28000R94 808,40
50R3 011,90640R150 595,32
Manufacturers Standard Package