
WS991SNL500T4 | |
|---|---|
DigiKey Part Number | 315-WS991SNL500T4-ND |
Manufacturer | |
Manufacturer Product Number | WS991SNL500T4 |
Description | SOLDER PASTE THERMALLY STABLE WS |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) |
Datasheet | Datasheet |
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423°F (217°C) | |
Flux Type | Water Soluble | |
Wire Gauge | - | |
Mesh Type | 4 | |
Process | Lead Free | |
Form | Jar, 17.64 oz (500g) | |
Shelf Life | 6 Months | |
Shelf Life Start | Date of Manufacture | |
Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | R1 861,42000 | R1 861,42 |
| 5 | R1 603,89200 | R8 019,46 |
| 10 | R1 503,98400 | R15 039,84 |
| 25 | R1 381,05560 | R34 526,39 |
| 50 | R1 294,48520 | R64 724,26 |
| 100 | R1 213,04630 | R121 304,63 |




