Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
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WS991SNL35T4

DigiKey Part Number
315-WS991SNL35T4-ND
Manufacturer
Manufacturer Product Number
WS991SNL35T4
Description
THERMALLY STABLE SOLDER PASTE WS
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Datasheet
 Datasheet
Product Attributes
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Category
Melting Point
423°F (217°C)
Manufacturer
Chip Quik Inc.
Flux Type
Water Soluble
Series
Mesh Type
4
Packaging
Bulk
Form
Syringe, 1.23 oz (34.869g)
Part Status
Active
Shelf Life
12 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 0
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All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R697,63000R697,63
5R601,20200R3 006,01
10R563,86600R5 638,66
25R517,97600R12 949,40
50R485,68620R24 284,31
100R455,33150R45 533,15
Manufacturers Standard Package