HF115TAAC-54, 58
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HF115AC-0.0055-AC-58

DigiKey Part Number
BER168-ND
Manufacturer
Bergquist
Manufacturer Product Number
HF115AC-0.0055-AC-58
Description
THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Hi-Flow® 115-AC
Packaging
Bulk
Part Status
Active
Usage
TO-220
Type
Pad, Sheet
Shape
Rectangular
Outline
19.05mm x 12.70mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
HF115AC
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 3 770
Check for Additional Incoming Stock
Quantity
All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R7,63000R7,63
10R6,74100R67,41
25R6,41200R160,30
50R6,18340R309,17
100R5,95980R595,98
300R5,62300R1 686,90
500R5,47282R2 736,41
1 000R5,27491R5 274,91
5 000R4,84231R24 211,55
Manufacturers Standard Package
You May Also Be Interested InSee All
5 Items
THFU 2 TO 220

THFU 2 TO 220

Retaining Spring for Transistors

Fischer Elektronik

R2,25290
HF115AC-0.0055-AC-54

HF115AC-0.0055-AC-54

THERM PAD 19.05MMX12.7MM W/ADH

Bergquist

R7,45000
LAM 6 K 150 12

LAM 6 K 150 12

Aluminium Cooling aggregates LAM

Fischer Elektronik

R3 319,39000
A10832-02

A10832-02

THERM PAD 228.6MMX228.6MM YLW

Laird Technologies - Thermal Materials

R862,51000
SP400-0.007-00-58

SP400-0.007-00-58

THERM PAD 19.05MMX12.7MM GRAY

Bergquist

R8,49000