HF115AC-0.0055-AC-54
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HF115AC-0.0055-AC-54

DigiKey Part Number
BER167-ND
Manufacturer
Bergquist
Manufacturer Product Number
HF115AC-0.0055-AC-54
Description
THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Hi-Flow® 115-AC
Packaging
Bulk
Part Status
Active
Usage
TO-220
Type
Pad, Sheet
Shape
Rectangular
Outline
19.05mm x 12.70mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
HF115AC
In-Stock: 1 275
Can ship immediately
Quantity
All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R7,68000R7,68
10R6,88000R68,80
25R6,54760R163,69
50R6,31160R315,58
100R6,08470R608,47
300R5,73983R1 721,95
500R5,58616R2 793,08
1 000R5,38423R5 384,23
5 000R4,94266R24 713,30
Manufacturers Standard Package
You May Also Be Interested InSee All
5 Items
SPK4-0.006-00-58

SPK4-0.006-00-58

THERM PAD 19.05MMX12.7MM GRAY

Bergquist

R2,86000
HF115AC-0.0055-AC-58

HF115AC-0.0055-AC-58

THERM PAD 19.05MMX12.7MM W/ADH

Bergquist

R7,86000
SP900S-0.009-AC-54

SP900S-0.009-AC-54

THERM PAD 19.05MMX12.7MM W/ADH

Bergquist

R5,36000
A10832-02

A10832-02

THERM PAD 228.6MMX228.6MM YLW

Laird Technologies - Thermal Materials

R889,39000
53-77-4ACG

53-77-4ACG

THERM PAD 19.05X12.7MM W/ADH

Boyd Laconia, LLC

R14,65000