Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA33002-21P/CU/3.4Y

DigiKey Part Number
4573-MBA33002-21P/CU/3.4Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA33002-21P/CU/3.4Y
Description
CU HEAT SINK 33X33X21MM WITH PIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.299" (33.00mm)
Width
1.299" (33.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

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In-Stock: 40
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Quantity
All prices are in ZAR
Tray
QuantityUnit PriceExt Price
1R95,28000R95,28
10R84,25500R842,55
25R80,26280R2 006,57
50R77,36220R3 868,11
100R74,56610R7 456,61
250R71,01908R17 754,77
500R68,44538R34 222,69
1 000R65,96259R65 962,59
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
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