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Lead Free No-Clean Wire Solder Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) 27 AWG, 28 SWG Spool, 0.25 lb (113g)
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WIREFC-500591-0113

DigiKey Part Number
6204-WIREFC-500591-0113-ND
Manufacturer
Manufacturer Product Number
WIREFC-500591-0113
Description
IND291 CW818 3% 0.015" 1/4LB
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Wire Solder Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) 27 AWG, 28 SWG Spool, 0.25 lb (113g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Indium Corporation of America
Series
Packaging
Spool
Part Status
Active
Type
Wire Solder
Composition
Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Diameter
0.015" (0.38mm)
Melting Point
441°F (227°C)
Flux Type
No-Clean
Wire Gauge
27 AWG, 28 SWG
Mesh Type
-
Process
Lead Free
Form
Spool, 0.25 lb (113g)
Shelf Life
120 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
50°F ~ 104°F (10°C ~ 40°C)
Digi-Key Storage
-
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In-Stock: 35
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All prices are in ZAR
Spool
QuantityUnit PriceExt Price
1R1 173,09000R1 173,09
5R1 010,92800R5 054,64
10R948,08200R9 480,82
25R870,77000R21 769,25
50R816,35520R40 817,76
100R765,18020R76 518,02
Manufacturers Standard Package