SMDLTLFP50T6
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SMDLTLFP50T6

DigiKey Part Number
315-SMDLTLFP50T6-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMDLTLFP50T6
Description
SOLDER PASTE IN JAR 50G (T6) SN4
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Diameter
-
Melting Point
280°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Shipping Info
-
Weight
-
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In-Stock: 2
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Quantity
All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R2 225,35000R2 225,35
5R1 917,32200R9 586,61
10R1 797,78000R17 977,80
25R1 650,68240R41 267,06
50R1 547,07680R77 353,84
100R1 449,60770R144 960,77
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