SMD to DIP SOIC 24 0.050" (1.27mm) FR4 Epoxy Glass
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DIP300-SOIC-24N

DigiKey Part Number
315-DIP300-SOIC-24N-ND
Manufacturer
Manufacturer Product Number
DIP300-SOIC-24N
Description
DIP-24 (0.3" WIDTH, 0.1" PITCH)
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP SOIC 24 0.050" (1.27mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Proto Board Type
SMD to DIP
Package Accepted
SOIC
Number of Positions
24
Pitch
0.050" (1.27mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
1.200" L x 0.400" W (30.48mm x 10.16mm)
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In-Stock: 29
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All prices are in ZAR
Bulk
QuantityUnit PriceExt Price
1R220,64000R220,64
5R190,99400R954,97
10R180,45800R1 804,58
25R168,23480R4 205,87
50R160,10520R8 005,26
100R152,82570R15 282,57
250R144,35040R36 087,60
500R138,70392R69 351,96
1 000R133,63885R133 638,85
Manufacturers Standard Package