Heat Sink TO-3 Aluminum 2.0W @ 30°C Board Level
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Heat Sink TO-3 Aluminum 2.0W @ 30°C Board Level
501303B00000G
501303B00000G

501303B00000G

DigiKey Part Number
HS148-ND
Manufacturer
Boyd Laconia, LLC
Manufacturer Product Number
501303B00000G
Description
HEAT SINK TO-3 .500" COMPACT
Manufacturer Standard Lead Time
16 Weeks
Customer Reference
Detailed Description
Heat Sink TO-3 Aluminum 2.0W @ 30°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Boyd Laconia, LLC
Series
-
Packaging
Bag
Part Status
Active
Type
Board Level
Package Cooled
TO-3
Attachment Method
Bolt On
Shape
Rhombus
Length
1.880" (47.75mm)
Width
1.400" (35.56mm)
Diameter
-
Fin Height
0.500" (12.70mm)
Power Dissipation @ Temperature Rise
2.0W @ 30°C
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 300 LFM
Thermal Resistance @ Natural
12.00°C/W
Material
Aluminum
Material Finish
Black Anodized
Base Product Number
501303
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In-Stock: 902
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Quantity
All prices are in ZAR
Bag
QuantityUnit PriceExt Price
1R109,23000R109,23
10R96,67300R966,73
25R92,08600R2 302,15
50R88,76200R4 438,10
100R85,55080R8 555,08
250R81,48056R20 370,14
500R78,52744R39 263,72
1 000R75,67799R75 677,99
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