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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 2 449
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Quantity
All prices are in ZAR
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | R43,36000 | R43,36 |
| 10 | R38,33400 | R383,34 |
| 25 | R36,51120 | R912,78 |
| 50 | R35,19580 | R1 759,79 |
| 100 | R33,92450 | R3 392,45 |
| 250 | R32,31168 | R8 077,92 |
| 756 | R30,46479 | R23 031,38 |
| 1 512 | R29,36042 | R44 392,96 |
| 5 292 | R27,46196 | R145 328,69 |
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