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342949-COPPER SKIVFIN

DigiKey Part Number
59-342949-COPPERSKIVFIN-ND
Manufacturer
Boyd Laconia, LLC
Manufacturer Product Number
342949-COPPER SKIVFIN
Description
342949
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Copper Board Level
Product Attributes
Type
Description
Select All
Category
Mfr
Boyd Laconia, LLC
Series
-
Packaging
Bulk
Part Status
Active
Type
Board Level
Package Cooled
BGA, FPGA
Attachment Method
Push Pin, Thermal Material
Shape
Square, Fins
Length
3.150" (80.00mm)
Width
3.150" (80.00mm)
Diameter
-
Fin Height
0.472" (12.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
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This product requires a manufacturer-approved quote before it can be ordered. Orders must meet the manufacturer’s standard package quantity, may be subject to extended lead times, and cannot be canceled or returned. Quotes are typically processed within 3–5 business days after submission.
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