Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount, Extrusion
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount, Extrusion
ATS Explains - Thermal Interface Material

ATS-06D-132-C2-R0

DigiKey Part Number
ATS11200-ND
Manufacturer
Manufacturer Product Number
ATS-06D-132-C2-R0
Description
HEATSINK 60X60X25MM XCUT T766
Manufacturer Standard Lead Time
8 Weeks
Customer Reference
Detailed Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount, Extrusion
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Tray
Part Status
Active
Type
Top Mount, Extrusion
Package Cooled
Attachment Method
Push Pin
Shape
Square, Fins
Length
2.362" (60.00mm)
Width
2.362" (60.00mm)
Diameter
-
Fin Height
0.984" (25.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
2.66°C/W @ 100 LFM
Thermal Resistance @ Natural
-
Material
Material Finish
Blue Anodized
Base Product Number
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 277
Check for Additional Incoming Stock
All prices are in ZAR
Tray
QuantityUnit PriceExt Price
1R164,72000R164,72
10R145,76300R1 457,63
25R138,84360R3 471,09
50R133,82480R6 691,24
100R128,98110R12 898,11
250R122,84000R30 710,00
500R118,38380R59 191,90
1 000R114,08426R114 084,26
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.