RA8M2 and RA8D2 Dual-Core Arm® Cortex®-M85 and Cortex-M33

Renesas RA8M2 and RA8D2 MCUs feature Arm Cortex-M85 and Cortex-M33 cores that deliver breakthrough performance of up to 7300 Coremark, and fully deterministic, low-latency, real-time operation that meets demanding application needs. The RA8M2 and RA8D2 are ultra-high-performance, general-purpose, graphics MCUs and part of the second generation of the RA8 series. These devices are built on the 22 nm ULL process and take performance up by a magnitude to 1 GHz on the CM85 core and 250 MHz on the CM33 core. The device includes single- and dual-core options and a specialized feature set to address the needs of a broad base of compute-intensive applications. The RA8M2 and RA8D2 devices include embedded MRAM that has several advantages over Flash technology, including high endurance and data retention, faster writes, no erase needed, and byte addressablity with lower leakage and manufacturing costs.

The RA8D2 integrates graphics peripherals such as a high-resolution graphics LCD controller with parallel RGB and MIPI DSI interfaces and a 2D graphics drawing engine. These are highly integrated MCUs with large memory and flexible external memory interfaces to enable high-performance graphics applications. 16-bit parallel and MIPI CSI-2 camera interfaces are included for acquisition of image and video data from camera sensors. PDM and SSI interfaces enable audio and voice AI applications. Several connectivity features, including Gigabit Ethernet, TSN Switch, Octal SPI, USB, and CAN-FD interfaces, are available for communication. The devices are available in large 176-, 224-, and 289-pin packages, providing plenty of IO for real-time control needs.

• 1 GHz single- and dual-core RA8M2 and RA8D2 MCUs, built on the 22 nm ULL process and powered by the Arm Cortex-M85 and Cortex-M33 cores, deliver high performance, high integration, and efficient system partitioning
• Arm Cortex M85-based RA8D2 MCUs deliver advanced HMI/graphics capabilities and enable high resolution HMI/graphics and vision AI applications
• Significant increase in performance and power efficiency with dual-core MCUs built on the advanced 22 nm ULL process and integrated with new embedded MRAM technology
• Highest level of privacy, confidentiality, and integrity with advanced leading-edge security based on the RSIP-E50D cryptographic engine and advanced security features and solutions
• Jumpstart evaluation and development with comprehensive and easy-to-use solutions including FSP, RTOS and Zephyr support, tools, EKs, and a strong Ecosystem network