LM3291 Product Brief Datasheet by Texas Instruments

I TEXAS INSTRUMENTS
2.5V - 5V
LC
3G/4G
3G/4G
MBMM PA
SB PA
MIPI eTrak
LM3290
RFIC
or
BBIC
3G/4G
BATTERY
MIPI RFFE
LM3291
LM3291
www.ti.com
SNVSA12 –SEPTEMBER 2013
LM3291 Product Brief
1FEATURES DESCRIPTION
The LM3291 is a high-speed linear amplifier that, with
23• Highly Programmable High-Current Linear its companion IC LM3290, constitutes an RF
Amplifier Envelope Modulator (EM) for supplying 3G/4G Power
• > 75 MHz Typical Small Signal Bandwidth Amplifiers (PA) in envelope tracking systems. The
• Extremely Low Output Impedance amplifier provides extremely low output impedance
and low output noise over a wide bandwidth.
• High Linearity
In conjunction with an Envelope Tracking (ET)
• Differential Analog Input Compatible with capable RFIC and PA, the LM3291 and LM3290
eTrak 1.0 Standard greatly improve PA efficiency for 3G and LTE
• Low Output Noise operation.
• When paired with the LM3290 provides a In ET mode, the LM3291 and LM3290 provide
complete Envelope Modulator solution for envelope tracking supply voltage for the PA
3G/4G Envelope Tracking Power Amplifiers. maximizing total EM + PA efficiency. The envelope
• Automatically controlled through LM3290 in an modulator follows the differential envelope reference
envelope modulation solution using MIPI®input signal delivered by the RFIC to the LM3291.
RFFE 1.1-compatible interface. The output is a single-ended dynamic power supply
voltage to the PA.
APPLICATIONS The LM3291 supports 3G and LTE operation up to 20
• 3G/LTE Handsets MHz signal bandwidth.
• 3G//LTE Tablets The LM3291’s programmable parameters are
controlled by LM3290 via a direct serial interface
• 3G/LTE Data Cards and Wireless Modems between the two devices. No additional controls are
needed in the system. This interface provides flexible
control and adjustment options to optimize LM3291
efficiency and noise performance for various
frequency bands and power levels.
At high TX output power, the EM can be operated in
ET mode where LM3290 and LM3291 together
modulate the supply of the PA with the envelope
signal to improve overall system efficiency. At low TX
output power, the EM can be transitioned to Average
Power Tracking (APT) mode where LM3291 is placed
into shutdown mode to improve system efficiency.
The LM3291 is available in a 12-pin lead-free DSBGA
package.
For the full datasheet, samples, or the EVM
hardware and software please contact a TI
representative at ET@list.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2MIPI is a registered trademark of Mobile Industry Processor Interface Alliance.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3291TME/NOPB NRND DSBGA YFQ 12 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -30 to 85 AE
LM3291TMX/NOPB NRND DSBGA YFQ 12 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -30 to 85 AE
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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