ECMF02-3F3 Datasheet by STMicroelectronics

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This is information on a product in full production.
December 2013 DocID023283 Rev 3 1/12
12
ECMF02-3F3
Common mode filter with ESD protection
Datasheet production data
Features
Very large differential bandwidth
Very low PCB space consumption
High ESD robustness: IEC 61000-4-2 level 4
Withstand 1000 ESD strikes
Lead-free Flip-Chip package
Small footprint
Very low profile
Complies with the following standard:
IEC 61000-4-2 level 4:
15 kV (air discharge)
8 kV (contact discharge)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required such as:
Mobile phones
Computers
Portable navigation devices
Digital still cameras
Portable multimedia players
Figure 1. Pin configuration (bump side)
Figure 2. Schematic (bump side)
Description
The ECMF02-3F3 is a highly integrated common
mode filter designed to suppress EMI/RFI
common mode noise on high speed differential
serial buses.
TM: IPAD is a trademark of STMicroelectronics.
Flip Chip
6 bumps
12
A
B
C
A1
DP_int
C1
GND
B1
DM_int
A2
DP_ext
B2
DM_ext
C2
ID
ESD 15kV
ESD 15kV
ESD 15kV
ESD 2kV
ESD 2kV
www.st.com
(Tamb
Characteristics ECMF02-3F3
2/12 DocID023283 Rev 3
1 Characteristics
Figure 3. Electrical characteristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP
IEC 61000-4-2 (C = 150 pF, R = 330 
External pins (A2, B2 and C2): level 4
Air discharge
Contact discharge
Internal pins (A1, B1): level 1
Air discharge
Contact discharge
15
8
2
2
kV
PdLine resistance power dissipation at 85 °C (top max) 60 mW
TjOperating temperature range - 30 to + 85 °C
Tstg Storage temperature range - 55 to 150 °C
Table 2. Electrical characteristics (values, Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 6 V
IRM VRM = 3 V per line 100 nA
RDC DC serial resistance 3.4 4.5
Symbol Parameter
VBreakdown voltage
ILeakage current @V
BM
RSerial resistance
BR
RM
DC
I
VCLVBR VRM
IF
IRM
IPP
=
=
=
100.0k 10M 10.0M 100 OM 106 mock 10M 10 SM 100 SM 106
DocID023283 Rev 3 3/12
ECMF02-3F3 Characteristics
Figure 4. SDD21 differential attenuation versus frequency
Figure 5. SCC21 common mode attenuation versus frequency (ID pin floating)
100.0k 1.0M 10.0M 100.0M 1.0G
-4.00
-3.00
-2.00
-1.00
0.00
SDD21 (dB)
F(Hz)
100.0k 1.0M 10.0M 100.0M 1.0G
-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
SCC21 (dB)
F(Hz)
mock 10M m 0M monM IOG
Characteristics ECMF02-3F3
4/12 DocID023283 Rev 3
Figure 6. SDD11 / SDD22 differential return loss versus frequency (ID pin floating)
Figure 7. Eye diagram (according to USB 2.0 high speed specification mask1)
100.0k 1.0M 10.0M 100.0M 1.0G
-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
F(Hz)
SDD22
SDD11
SDD11 / SDD22 (dB)
Board only
347.2 ps/c
200 mV/c
With ECMF02-
3F3, Id pin open
IDopen
347.2 ps/c
200 mV/c
Through ISS
(Impedance Standard Substrate)
With ECMF02-3F3
ID pin floating
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DocID023283 Rev 3 5/12
ECMF02-3F3 Characteristics
Figure 8. TDR: Z0 DIFF = 100 tR = 400 ps (10% - 90%),
Figure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge)
9‘ mm) D; M@><(c2) v3="" m@=""><(c2) m="" m@=""><(c2) vs="" ,="" v77="" ,="" ,uav="" vaclav="" 4am="" 757v="" ./="" ./="" ./="" ./="">
Characteristics ECMF02-3F3
6/12 DocID023283 Rev 3
Figure 10. ESD response to IEC 61000-4-2 (- 8 kV contact discharge)
E]
DocID023283 Rev 3 7/12
ECMF02-3F3 USB 2.0 application schematic
2 USB 2.0 application schematic
Figure 11. Application schematic
A2
DP_ext
C2
ID
B2
DM_ext
A1
DP_int
B1
DM_int
C1
GND
ESD 15kV
ESD 15kV
ESD 15kV
ESD 2kV
ESD 2kV
A2
DP_ext
C2
ID
B2
DM_ext
A1
DP_int
B1
DM_int
C1
GND
ESD 15kV
ESD 15kV
ESD 15kV
ESD 2kV
ESD 2kV
USB
CONTROLLER
ECMF02-3F3
GND
ID
D+
D-
VBUS
USB
CONNECTOR
D+
D-
Fundinn Number o! lines Number o! ESD retracted lines Packaqe
Ordering information scheme ECMF02-3F3
8/12 DocID023283 Rev 3
3 Ordering information scheme
Figure 12. Ordering information scheme
EF - FCM 02 3 3
Function
ESD common mode filter
Number of lines
02 = 2 lines
Number of ESD protected lines
3 = 3 ESD protected lines
Package
F3 = Flip Chip, 0.4 mm pitch
,0 O G COO
DocID023283 Rev 3 9/12
ECMF02-3F3 Package information
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 13. Package dimensions
Figure 14. Marking
1 µm ± 0 µm330 4
830 µm ± 30 µm
255 µm ± 40
400 µm ± 40
400 µm ± 40
500 0µm ± 5
215 µm
265 µm
Dot
ECOPACK grade
xx = marking
z = manufacturing location
yww = date code
(y = year
ww = week)
ww
y
xz
x
Package information ECMF02-3F3
10/12 DocID023283 Rev 3
Figure 15. Footprint recommendations
Figure 16. Flip Chip tape and reel specification
Note: More information is available in the application notes:
AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
AN1751, “EMI filters: recommendations and measurements”
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are in mm
4.0 ± 0.1
4.0 ± 0.1
2.0 ± 0.05
8.0 + 0.3 / - 0.1
1.75 ± 0.1
3.5 ± 0.05
Ø 1.50 ± 0.1
0.59 ± 0.05
0.93 ± 0.05
0.20 ± 0.02
1.43 ± 0.05
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
E]
DocID023283 Rev 3 11/12
ECMF02-3F3 Ordering information
5 Ordering information
6 Revision history
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
ECMF02-3F3 KH Flip Chip 1.2 mg 5000 Tape and reel 7”
Table 4. Document revision history
Date Revision Changes
19-Nov-2012 1 Initial release.
22-May-2013 2 Moved dot position in Figure 13. Moved arrow in Figure 16 to point
to pin A1 location.
19-Dec-2013 3 Corrected typographical error in Figure 13.
ECMF02-3F3
12/12 DocID023283 Rev 3
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